Research Intern
Li Hongtao
Hardware Design & Embedded Development
Li Hongtao graduated from China University of Mining and Technology (Beijing) with a degree in Electrical Engineering and is currently pursuing a Master's degree in Power Engineering at Nanyang Technological University, Singapore. He has a strong passion for hardware design and embedded development, with proficiency in software such as SOLIDWORKS, Altium Designer, and Multisim.
Li has actively participated in several research and engineering projects, including a cloud computing-based AR system and a fire alarm system using semiconductor sensor arrays. From December 2023 to June 2024, Li worked as a research assistant at the Department of Electrical Engineering at Tsinghua University, focusing on the thermal characteristics of SiC MOSFETs.
As a skilled competitor, he has won several national and regional awards, including the second prize in the Beijing Division of the National Undergraduate Electronic Design Competition (October 2023) and the second prize in the National Undergraduate Intelligent Vehicle Competition (December 2023). Li is an electronics enthusiast who frequently replicates outstanding electronic DIY projects from GitHub using STM32, DSP and Raspberry Pi.
During his freshman year, Li co-founded the 3D printing club at his university and served as the vice president. He successfully designed, selected parts, and assembled small FDM and SLA 3D printers.
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